This system includes a 6000 rpm spin module with edge bead removal, a high temperature bake module, and an active cooling module along a linear track. Four inch wafers are loaded automatically from a standard cassette. Conversion for wafers up to six inch is possible. Special carrier wafers are used to accommodate small substrates. A touch screen GUI provides flexible recipe control. Three separate cartridges dispense fluids onto the substrate. The system is used for deposition of prompt inorganic condensation materials.