Oregon State University

Thermal Evaporation

Polaron thermal evaporator located in Owen Hall cleanroom The Polaron Thermal Evaporator uses a standard resistive filament evaporation source, and  a quartz bell jar deposition chamber.  The tool incorporates a diffusion pump as the high vacuum pump and reaches a base pressure of <  5 E-5 mbar.  The tool is used for depositing aluminum.

Polaron thermal evaporator

Owen cleanroom

Dr. John Wager

 

VEECO thermal evaporator located in the Owen cleanroom

The Veeco 7700 is a manually controlled thermal evaporator, equipped with water cooled feedthroughs, and capable current drive in the 220 Amp range.  A high current switch enables sequential deposition of two materials, and a second power source allows a third material to be deposited, without breaking vacuum.   Chamber base pressure is <  5 E-6 Torr range, and the system is equipped with a quartz crystal monitor for manual thickness control.  This evaporator is used for metal deposition.

VEECO

7700 Series

Thermal evaporator

Owen cleanroom

Dr. John Wager

 

 

 

OSU constructed radio frequency sputter deposition system in Owen cleanroom

This system incorporates electron beam, sputter and thermal deposition in one chamber.  An 8kW, six pocket rotary egun is used primarily for deposition of refractory metals.  Two 2” magnetrons are available for sputter deposition of chalcogenide materials.  In addition, the system is equipped with one thermal evaporation source.   The six inch substrate stage has heating to 850C, rotation, RF biasing and in situ adjustment of the source to substrate distance.  The system is load locked, and the chamber base pressure is <5e-8 Torr.  Process gas is Argon.

OSU Constructed

CDS

Multi technique physical vapor deposition system

Owen Cleanroom

Dr. John Wager

 

Picture of the Cooke thermal evaporator in the Owen cleanroom The Cooke thermal evaporator uses a standard resistive filament evaporation source, and  a stainless steel bell jar deposition chamber.  The tool incorporates a turbomolecular pump as the high vacuum pump and reaches a base pressure of ?????.  The tool is used for depositing aluminum.

Cooke thermal evaporator

Owen cleanroom

Dr. John Wager

Schrader thermal evaporator in Dr. Tate's lab. Schrader thermal evaporator.

Schrader thermal evaporator

Weniger 4??

Dr. Janet Tate

 

VEECO thermal evaporator in Dr. Tate's lab. VEECO thermal evaporator.

VEECO thermal evaporator

Weniger 4??

Dr. Janet Tate

 

 

 

CVC Thermal Evaporator The CV-164D Thermal Evaporator uses a standard resistive filament evaporation source, and  a quartz bell jar deposition chamber.  The tool incorporates a diffusion pump as the high vacuum pump and reaches a base pressure of < 2 E-6.  The tool is used for depositing ????.

CV-164D Thermal Evaporator

Dearborn 300

Dr. Brady Gibon

 

Picture of an OSU constructed evaporator in Dr. Minot's lab OSU constructed electron beam deposition system.

OSU constructed Ebeam

 

Dr. Ethan Minot

Picture of the glove box in the Owen cleanroom

This programmable logic controller (PLC) glove box is used for work that must be carried out in dry, inert Nitrogen ambient.  The oxygen content is typically below 20 parts per million.  The system is equipped with an antechamber for transfer of smaller items, and a large 600C vacuum oven for dehydration/baking, and to serve as a pass through for large items.  The glove box is also equipped with a vacuum thermal evaporator for deposition of materials that cannot be exposed to Oxygen or moisture.

MBraun

Labmaster 130, VOH-600 Oven

Glove box with oven and thermal evaporator

Owen Cleanroom

Dr. John Wager

 

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