• Wellington da Silva Mattos, Barbara Rivolta, George E. Totten, Lemmy Meekisho, Lauralice C.F. Canale, “Quenching of Aluminum Alloys”, in Encyclopedia of Aluminum and Its Alloys (EAIA)", Eds. G.E. Totten, M. Tiryakioglu, O. Kessler, Taylor & Francis, Boca Raton, FL, In Production, 2018.

  • Lauralice C.F. Canale, Luigi L.M. Albano, Lemmy Meekisho, George E. Totten, and Kristina Rodgers, “Tempering Parameter Development”, in Encyclopedia of Iron, Steel and Their Alloys – Volume 5, Eds. Rafael Colás and George E. Totten, Taylor & Francis, Boca Raton, FL p.3551-3559. ISBN: 9781498762687, 2015

  • Lauralice C.F. Canale, Lemmy Meekisho, and George E. Totten, “Hardening: Practical Aspects”, in Encyclopedia of Iron, Steel and Their Alloys – Volume 2, Eds. Rafael Colás and George E. Totten, Taylor & Francis, Boca Raton, FL p.1419-1442. ISBN: 9781466511095, 2015

  • Fundamentals of Lead-Free Solder Interconnect Technology (book), Tae-Kyu Lee, Thomas Bieler, Choong-un Kim and Hongtao Ma, ISBN 978-1-4614-9266-5, Springer 2015

  • Rosa Simencio Otero, Luigi L.M. Albano, Lauralice C.F. Canale, George E. Totten, Lemmy Meekisho, “Quench System Design for Induction Hardening”, in Encyclopedia of Iron, Steel and Their Alloys –Volume 4, Eds. Rafael Colás and George E. Totten, Taylor & Francis, Boca Raton, FL p. 2706-2743. ISBN: 9781498762670, 2015

  • Canale, L. C. F., Vatavuk, J.; Totten, G. E., Meekisho, L. “Introduction to Steel Heat Treatment. In Comprehensive Materials Processing; Krauss, G., Ed.; Elsevier Ltd., 2014; Vol. 12, pp 3–37.

  • Meekisho, L.L., Maniruzzaman, M., Kizer, M.T. and Block, V. "Hardenability Calculations of Carbon and Low-Alloy Steels with Low or Medium Carbon". ASM Handbook Vol. 4A, 2013, pp 60-79.

  • Lead Free solder, Encyclopedia of Materials: Science and Technology (Book Chapter), T.R. Bieler and Tae-Kyu Lee, 2010, 1-12, Elsevier

  • Meekisho, L., Yao, X., Totten, G.E., “Quenching of Titanium Alloys”, In Quenching Theory and Technology, 2/E, Taylor & Francis Group, ISBN 978-0-8494-9279-5, 2009.

  • L Teeter, B Adam, T Wood, JD Tucker, "Comparison of the corrosion of materials in supercritical carbon dioxide, air, and argon environments", Corrosion Science 192, 109752, 2021

  • BM Adam, JD Tucker, G Tewksbury, "Comparative study of the hot processing behavior in advanced Ni-based superalloys for use in A-USC applications", Journal of Alloys and Compounds 818, 152907, 2020

  • B Adam, J Tucker, G Tewksbury, "Hot deformation data for Haynes 214, Haynes 230 and Inconel 740H", Data in brief 28, 104923, 2020

  • B Adam, L Teeter, J Mahaffey, M Anderson, L Árnadóttir, JD Tucker, "Effects of Corrosion in Supercritical CO2 on the Microstructural Evolution in 800H Alloy", Oxidation of Metals 90 (3-4), 453-468, 2018

  • LH Sprowl, BM Adam, JD Tucker, L Árnadóttir, "First-principles study of the products of CO2 dissociation on nickel-based alloys: Trends in energetics with alloying element", Surface Science 677, 219-231, 2018

  • Meekisho, L., Simencio, R.O., Viscaino, J.M., Mackenzie, D.S., Totten, G.E., Canale, L.C.F., “Assessment of Cooling and Heat Transfer Properties of Quenchants with MATLAB”, To appear in the Journal of Materials Performance and Characterization, Final edits submitted July 24, 2018.

  • WE Wood, B Adam, J Kadali, R Talla, T Langston, "Heat-Affected Zone Formation in Electrospark-Deposition Additive Manufacturing on Ultrahigh-Strength Steel", Materials Performance and Characterization 6 (3), 376-393, 2017

  • Rosa L. Simencio Otero, Lauralice C.F. Canale, George E. Totten, Lemmy Meekisho, “Vegetable Oils as Metal Quenchants: A Comprehensive Review”, Materials Performance and Characterization, 2017, Vol. 6, No. 1, p. 174-250.   DOI:  10.1520/MPC20160112.

  • Quan Zhou, Bite Zhou, Tae-Kyu Lee and Thomas R. Bieler, Microstructural Evolution of SAC305 Solder Joints in Wafer Level Chip-Scale Packaging (WLCSP) with Continuous and Interrupted Accelerated Thermal Cycling, Journal of Electronic Materials, 45 2016, [online first, DOI: 10.1007/s11664-016-4343-6]

  • Tae-Kyu Lee, Choong-Un Kim, Thomas R. Bieler, Impact of cooling rate on low silver Sn-Ag-Cu solder interconnect board level mechanical shock and thermal cycling performance, Journal of Electronic Materials, 45 (1), 2016, 172-181

  • Christine Jill Lee,  Wei-Yu Chen, Tzu-Ting Chou, Tae-Kyu Lee, Yew-Chung Wu,  Tao-Chih Chang, Jenq-Gong Duh, The investigation of interfacial and crystallographic observation in the Ni(V)/SAC/OSP Cu solder joints with high and low silver content during thermal cycling test, Journal of Materials Science : Mater Electron, 26, 2015, 10055-10061 

  • Bite Zhou, Quan Zhou, Thomas R. Bieler and Tae-kyu Lee, Slip, Crystal Orientation, and Damage Evolution During Thermal Cycling in High-Strain Wafer-Level Chip-Scale Packages, Journal of Electronic Materials, 44 (3), 2015, 895-908

  • Tae-Kyu Lee, and Weidong Xie, Effect of board thickness on Sn-Ag-Cu joint interconnect Thermal cycling and Dynamic shock performance, Journal of Electronic Materials, 43 (12), 2014, 4522-4531

  • Tae-Kyu Lee and Jeng-Gong Duh, Effect of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Sn–Ag–Cu and Sn–Ag Solder Interconnects With and Without Board-Side Ni Surface Finish, Journal of Electronic Materials,           43(11), 2014, 4126-4133

  • Payam Darbandi, Farhang Pourboghrat, Thomas R. Bieler, Tae-kyu Lee, The Effect of Cooling Rate on Grain Orientation and Misorientation Microstructure of SAC105 Solder Joints Before and After Impact Drop Tests, Journal of Electronic Materials, 43(7), 2014, 2521-2529

  • Payam Darbandi, Tae-Kyu Lee, Thomas Bieler, Farhang Pourboghrat, Crystal plasticity finite element study of deformation behavior in commonly observed microstructures in lead free solder joints, Computational Materials Science, 85(4), 2014, 236-243

  • Tae-Kyu Lee, Choong-Un Kim, Thomas R. Bieler, Influence of high G mechanical shock and thermal cycling on localized recrystallization in Sn-Ag-Cu solder interconnects, Journal of Electronic Materials, 43(1), 2014, 69-79

  • Choong-Un Kim, Woong-Ho Bang, Huili Xu, and Tae-Kyu Lee, Characterization of Solder Joint Reliability Using Cyclic Mechanical Fatigue Testing, Journal of Metals (JOM), 65(10), 2013, 1362-1373

  • Tae-Kyu Lee,   Impact of electrical current on the long term reliability of fine pitch ball grid array packages with Sn-Ag-Cu solder interconnects, Journal of Electronic Materials, 42(4), 2013, 599-606

  • Payam Darbandi, Thomas Bieler, Farhang Pourboghrat and Tae-Kyu Lee, Crystal Plasticity Finite Element Analysis of Deformation Behavior in Multiple-Grained Lead-Free Solder Joints, Journal of Electronic Materials,         42(2), 2013, 201-214

  • Bite Zhou, Thomas Bieler, Tae-Kyu Lee, Wenjun Liu, Characterization of recrystallization and microstructure evolution in lead-free solder joints using EBSD and 3D-XRD, Journal of Electronic Materials, 42(2), 2013, 319-331

  • Tae-Kyu Lee, Bite Zhou, Thomas Bieler, Chien-Fu Tseng and Jeng-gong Duh, The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance, Journal of Electronic Materials, 42(2), 2013, 215-223

  • Hongtao Ma, Tae-Kyu Lee, The Effects of Board Design Variations on the Reliability of Lead-Free Solder Joints, IEEE Transactions on Components and Packaging and Manufacturing Technology, 3(1), 2013, 71-78

  • Hongtao Ma, Tae-Kyu Lee, Dong-hyun Kim, H.G.Park, Sang-Ha Kim, KC Liu, Isothermal Aging Effects on the Mechanical Shock Performance of Lead-Free, IEEE Transactions on Components and Packaging and Manufacturing Technology, 1(5) 2011, 714-721

  • Tae-Kyu Lee, Bite Zhou and Thomas Bieler, Impact of isothermal aging and Sn grain orientation on the long-term reliability of wafer-level chip-scale package Sn-Ag-Cu solder interconnects, IEEE Transactions on Components and Packaging and Manufacturing Technology, 2(3), 2012, 496-501

  • Hyelim Choi, Tae-Kyu Lee, Yunsung Kim, Hoon Kwon, Chien-Fu Tseng, Jenq-Gong Duh, Heeman Choe, Improved strength of boron-doped Sn-1.0Ag-0.5Cu solder joints under aging conditions, Intermetallics, 20(1), 2012, 155-159

  • Shao-Wei Fu, Chi-Yang Yu, Tae-Kyu Lee, Kuo-Chuan Liu, Jenq-Gong Duh , Impact crack propagation through the dual-phased (Cu,Ni)6Sn5 layer in Sn-Ag-Cu/Ni solder joints, Materials Letters, 80(1), 2012, 103–105

  • Chien-Fu Tseng, Tae-Kyu Lee, Gnyaneshwar Ramakrishna, Kuo-Chuan Liu, Jenq-Gong Duh , Suppressing Ni3Sn4 formation in the Sn–Ag–Cu solder joints with Ni–P/Pd/Au surface finish, Materials Letters , 65(21-22), 2011, 3216–3218

  • Bite Zhou, Thomas R. Bieler, Guilin Wu, Stefan Zaefferer, Tae-Kyu Lee and Kuo-Chuan Liu, In Situ Synchrotron Characterization of Melting, Dissolution, and Resolidification in Lead-Free Solders, Journal of Electronic Materials, 41(2), 2012, 262-272

  • Thomas R. Bieler, Bite Zhou, Lauren Blair, Amir Zamiri, P. Darbandi, F.Pourboghrat, Tae-Kyu Lee and Kuo-Chuan Liu, The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints, Journal of Electronic Materials, 41(2), 2012, 283-301

  • Tae-Kyu Lee, Bite Zhou, Thomas Bieler and Kuo-Chuan Liu, Impact of Microstructure Evolution and Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock Performance and Crack Propagation, Journal of Electronic Materials, 41(2), 2012, 273-282

  • Bo Liu, Tae-Kyu Lee and Kuo-Chuan Liu, Impact of 5% NaCl Salt Spray Pretreatment on the Long-Term Reliability of Wafer-Level Packages with Sn-Pb and Sn-Ag-Cu Solder Interconnects, Journal of Electronic Materials, 40(10), 2011, 2111-2118 (corresponding author)

  • Tae-Kyu Lee, Weidong Xie, Bite Zhou, Thomas Bieler and Kuo-Chuan Liu, Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Die Size Effects, Journal of Electronic Material, 40(9), 2011, 1967-1976

  • Tae-Kyu Lee, Bo Liu, Bite Zhou, Thomas Bieler and Kuo-Chuan Liu, Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects, Journal of Electronic Materials, 40(9), 2011, 1895-1902

  • Bite Zhou, Thomas R. Bieler, Tae-kyu Lee and Kuo-Chuan Liu, Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface, Journal of Electronic Materials, 39(12), 2010, 2669-2679

  • Chi-Yang Yu, Tae-Kyu Lee, Michael Tsai, Kuo-Chuan Liu and Jenq-Gong Duh, Effects of Minor Ni Doping on Microstructural Variations and Interfacial Reactions in Cu/Sn-3.0Ag-0.5Cu-xNi/Au/Ni Sandwich Structures, Journal of Electronic Materials, 39(12), 2010, 2544-2552

  • Tae-Kyu Lee, Bite Zhou, Lauren Blair, Kuo-Chuan Liu and Thomas Bieler, Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy, Journal of Electronic Materials, 39(12), 2010, 2588-2597

  • Tae-Kyu Lee, Hongtao Ma, Kuo-Chuan Liu and Jie Xue, Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects, Journal of Electronic Materials, 39(12), 2010, 2564-2573

  • Thomas Bieler, Tae-Kyu Lee and Kuo-Chuan Liu, Methodology for analyzing strain states during in-situ thermomechanical cycling in individual lead-free solder joints using Synchrotron radiation, Journal of Electronic Materials, 38(12), 2009, 2712-2719

  • Christopher Kinney, Tae-Kyu Lee, Kuo-Chuan Liu and J. W. Morris, The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects , Journal of Electronic Materials, 38(12), 2009, 2585-2591

  • Bite Zhou, Thomas R. Bieler, Tae-Kyu Lee, Kuo-Chuan Liu, Methodology for analyzing slip behavior in ball grid array lead free solder joints after simple shear, Journal of Electronic Materials, 38(12), 2009, 2702-2711

  • Tae-Kyu Lee, Kuo-Chuan Liu and Thomas R. Bieler, Microstructure and orientation evolution of the sn phase as a function of position in ball grid arrays in Sn-Ag-Cu solder joints, Journal of Electronic Materials, 38(12), 2009, 2685-2693

  • Christopher Kinney, J.W. Morris, Tae-Kyu Lee, Kuo-Chuan Liu, Jie Xue and Dave Towne, The Influence of an Imposed Current on the Creep of Sn-Ag-Cu Solder, Journal of Electronic Materials, 38(2), 2009, 221-226

  • Tae-Kyu Lee, Fay Hua and J.W.Morris, Jr., Heat effect and impact resistance during electromigration on Cu-Sn Interconnections, Electronic Materials Letters, 2(3), 2006, 157-160

  • Sikakollu, R.C., Meekisho, L., LaRosa, A., “Coupled Field Analyses in MEMS with Finite Element Analysis”, Journal of Heat Transfer, vol. 127, January, pp 34-37, 2005.

  • Meekisho, L.L., Hernández-Morales, B., Téllez-Martínez, J.S., Chen, X., “Computer-Aided Cooling Curve Analysis using WinProbe”, International Journal of Materials and Product Technology, vol. 24, No.1-4, pp 155-169, 2005.

  • D.M. Clatterbuck, Tae-Kyu Lee, T.J. Shaw, N.F. Heinig, Hsiao-Mei Cho, J. Clarke, J.W. Morris Jr, Detection of plastic deformation gradients in steel using scanning SQUID microscopy, IEEE Transactions on Applied Superconductivity, 4, 2001,1307-1310

  • Tae-Kyu Lee, H. J. Kim, B. Y. Kang, S. K. Hwang, Effect of Inclusion Size on the Nucleation of Acicular Ferrite in Welds, ISIJ International, 40(12), 2000, 1260-1268

  • Tae-Kyu Lee, E. I. Mosunov, S. K. Hwang, Consolidation of a gamma TiAl–Mn–Mo alloy by elemental powder metallurgy, Materials Science and Engineering A, 239-240, 1997, 540-545

  • Tae-Kyu Lee, J. H. Kim, and S. K. Hwang, Direct consolidation of γ-TiAl-Mn-Mo from elemental powder mixtures and control of porosity through a basic study of powder reactions, Metallurgical and Materials Transactions A, 28(12), 1997, 2723-2729

  • Tae-Kyu Lee, S.K. Hwang, S.W. Nam, and N.J. Kim, Control of beta phase in an EPM-processed intermetallic compound based on Ti-Al-Mn-Mo, Scripta Materialia, 36(11), 1997,1249-1254

  • B. Adam et al., "Evaluation of microstructural evolution in isothermally aged ferritic candidate cladding materials for sodium-cooled fast reactor applications", M&M 2022, Portland, OR, August (2022)

  • B. Steingrimsson, B. Adam, M.C. Gao, G. Tewksbury, E. Huang and P.K. Liaw, "Defect Minimization in Additive Manufacturing through a Customized High-Throughput Experimental Methodology and Machine Learning", AIM 2022, Pittsburgh, PA, April (2022)

  • B. Adam et al., "Physical and numerical simulation of surface modification of structural metal alloys through ultrasonic impact treatment”, MS&T 2019, Portland, OR, September (2019)

  • B. Adam et al., “Influence of Thermal Processing and Hot Deformation on microstructural evolution in alloy 625”, TMS 2019, San Antonio, TX, March (2019)

  • B. Adam et al., “Microstructure-property relationships in advanced high deposition rate Cold Metal Transfer (CMT) additive manufactured IN718”, TMS 2018, Phoenix, AZ, March (2018) 

  • B. Adam et al., “Influence of Thermal Processing and Hot Deformation on the microstructural evolution and the (meta-) dynamic recrystallization in alloy IN625”, TMS 2018, Phoenix, AZ, March (2018)

  • Julie D. Tucker, B. Adam et al., “Supercritical CO2 round robin test program”, The 6th international supercritical CO2 power cycles symposium, Pennsylvania, PA, March (2018)

  • Julie D Tucker, Benjamin Adam, Mark Anderson, Bruce Pint, Gordon R Holcomb, Casey S Carney, Henry Saari, Lucas Teeter, Jacob Mahaffey, Ömer Doğan, Changheui Jang, Steven Kung, "Supercritical CO2 round robin test program", The 6th international supercritical CO2 power cycles symposium, Pennsylvania, USA; March 27–29, 2018

  • Rosa L. Simencio Otero, Jonatas M. Viscaiono, Lauralice C.F. Canale, George E. Totten, Lemmy Meekisho, “Quenchant Characterization Using The Tensi Probe”, Heat Treat 2017: Proceedings of the 29th Heat Treating Society Conference, pp 389-394, 2017

  • R.L. Simencio Otero, J.M. Viscaino, C.F. Canale, G.E. Totten, and L. Meekisho, “Quenchant Characterization using the TENSI Probe”, Heat Treat 2017: Proceedings of the 29th ASM Heat Treating Society Conference, October 24–26, 2017, Columbus, Ohio, USA

  • Tae-Kyu Lee, Weidong Xie, Thomas R. Bieler and Choong-Un Kim, The impact of microstructure evolution, localized recrystallization and board thickness on Sn-Ag-Cu interconnect board level shock performance, IEEE Proceedings, 64th Electronic Components and Technology Conference (ECTC), Orlando,FL, 2014, 697 – 702

  • Huili Xu, Tae-Kyu Lee, Choong-Un Kim, Fatigue Properties of Lead-free Solder Joints in Electronic Packaging Assembly Investigated by Isothermal Cyclic Shear Fatigue, IEEE Proceedings, 64th Electronic Components and Technology Conference (ECTC) , Orlando,FL, 2014, 133 – 138

  • Huili Xu, Tae-Kyu Lee, Choong-Un Kim, Grain Structure Evolution and its Impact on the Fatigue Reliability of Lead-free Solder Joints in BGA Packaging Assembly, IEEE Proceedings, 63rd Electronic Components and Technology Conference (ECTC), Las Vegas, NV, 2013, 740 – 747

  • Weidong Xie, Tae-Kyu Lee, and Steven Perng, Systematic investigation of impact of SMT parameters, isothermal aging and alloy microstructure on Ob free BGA solder joint reliability, SMTA International, Orlando,FL, 2012

  • Huili Xu, W.H.Bang, Hongtao Ma, Tae-Kyu Lee, KC Liu, and ChoongUn Kim, Isothermal shear fatigue mechanism of lead free solder joints, IEEE Proceedings, 62th Electronic Components and Technology Conference (ECTC), San Diego,CA, 2012, 1299 – 1303

  • Huili Xu, W.H.Bang, Tae-Kyu Lee, and ChoongUn Kim, Sensitivity of grain structure and fatigue reliability of Pb-free solder joint on the position in BGA packaging assembly, IEEE Proceedings, 62th Electronic Components and Technology Conference (ECTC), San Diego,CA, 2012, 500 – 504

  • Tae-Kyu Lee and Hongtao Ma, Aging Impact on the Accelerated Thermal cycling Performance of Lead-free BGA Solder Joints in Various Stress Conditions, IEEE Proceedings, 62th Electronic Components and Technology Conference (ECTC), San Diego,CA, 2012, 477 – 482

  • R.Morusupalli, R.Rao, Tae-Kyu Lee, Yu-Lin Shen, M.Kunz, N.Tamura, A.Budiman, Critical temperature shift for Stress Induced Voiding in advanced Cu interconnects for 32 nm and beyond, IEEE Proceedings, International Reliability Physics Symposium (IRPS2012), Monterey, CA, 2012, EM.8.1 - EM.8.3

  • Tae-Kyu Lee, Weidong Xie, and Kuo-Chuan Liu, Impact of isothermal aging on Sn-Ag-Cu solder interconnect board level High G mechanical shock performance, IEEE Proceedings, 61st Electronic Components and Technology Conference (ECTC), Orlando,FL, 2011, 547 – 552

  • Weidong Xie, Tae-Kyu Lee, Kuo-Chuan Liu, and Jie Xue, Investigation on the failure criterion of reliability testing for Pb-free BGA packages         43rd International Symposium on Microelectronics (IMAPS 2010), Raileigh, NC, 2010

  • Tae-Kyu Lee, Weidong Xie, Thomas R. Bieler, Kuo-Chuan Liu and Jie Xue, Impact of isothermal aging on fine pitch BGA packages with Sn-Ag-Cu solder interconnect, 43rd International Symposium on Microelectronics (IMAPS 2010), Raileigh, NC, 2010

  • Thomas R. Bieler, Bite Zhou, Lauren Blair, Amir Zamiri, Farhang Pourboghrat, Tae-Kyu Lee, and Kuo-Chuan Liu, The Role of Elastic and Plastic Anisotropy of Sn on Microstructure and Damage Evolution in Lead-Free Solder joints, IEEE Proceedings, International Reliability Physics Symposium (IRPS2011), Monterey, CA, 2011, 5F.1.1-5F.1.9

  • Hongtao Ma, Kuo-Chuan Liu, Tae-Kyu Lee and Dong-hyun Kim, Effects of PCB design variations on bend and ATC performance of lead-free solder joints, IEEE, Proceedings, 60th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, 2010, 1512 – 1517

  • Weidong Xie, Tae-Kyu Lee, Kuo-Chuan Liu, and Jie Xue, Pb-free solder joint reliability of fine pitch chip-scale packages, IEEE Proceedings, 60th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, 2010, 1587-1590

  • Huili Xu, Woong-ho Bang, Hongtao Ma, Tae-Kyu Lee, KC Liu, Fracture mechanics of lead-free solder joints under cyclic shear load, IEEE Proceedings, 60th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, 2010, 484-489

  • Anurag Bansal, Tae-Kyu Lee, Kuo-Chuan Liu, and Jie Xue, Effects of Isothermal Aging and In-Situ Current Stress on the Reliability of Lead-Free Solder Joints, IEEE Proceedings, 60th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, 2010, 1529 – 1535

  • Tae-Kyu Lee, Bite Zhou, Lauren Blair, Kuo-Chuan Liu Jie Xue and Thomas R. Bieler, The interaction between grain orientation evolution and thermal cycling as a function of position in ball grid arrays using Orientation Imaging Microscopy, IEEE Proceedings, 60th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, 2010, 1591 – 1595

  • Bo Liu, Tae-Kyu Lee, and  Kuo-Chuan Liu, Environmental Conditions Impacts on Pb-Free Solder Joint Reliability, 42nd International Symposium on Microelectronics (IMAPS 2009) proceedings, San Jose, CA, 2009

  • Tae-Kyu Lee, Bite Zhou, Lauren Blair, Kuo-Chuan Liu and Thomas R. Bieler, Grain Orientation and Microstructure Evolution in Sn-Ag-Cu solder joints as a Function of position in Ball grid array Packages, 42nd International Symposium on Microelectronics (IMAPS 2009) proceedings, San Jose, CA, 2009  

  • Bite Zhou, Thomas R. Bieler, Guilin Wu, Stefan Zaefferer, Tae-kyu Lee, Kuo-Chuan Liu, Characterization of Microstructure and Internal Strain (stress) Evolution During Thermal Cycling, 42nd International Symposium on Microelectronics (IMAPS 2009) proceedings, San Jose, CA, 2009

  • Hongtao Ma, Tae-Kyu Lee, Dong Hyun Kim, Sang Ha Kim, Han G. Park, and Kuo-Chuan Liu, Isothermal Aging Effects on the Dynamic Performance of Lead-Free Solder Joints        IEEE Proceedings, 59th Electronic Components and Technology Conference (ECTC), San Diego, CA, 2009, 390 – 397

  • Woong Ho Bang, Liang-Shan Chen, Choong-Un Kim, Tae-Kyu Lee and Kuo-Chuan Liu, Rate Dependence of Bending Fatigue Failure Characteristics of Lead-Free Solder Joint, IEEE Proceedings, 59th Electronic Components and Technology Conference (ECTC), San Diego, CA, 2009, 2070-2074

  • Tae-Kyu Lee, J.W. Morris, Jr., Seungkyun Lee and John Clarke, Detection of fatigue damage prior to crack initiation with scanning SQUID microscopy, Review of Quantitative Nondestructive Evaluation, vol.25, 2006, 1378-1385

  • Tae-Kyu Lee, Fay Hua and J.W.Morris, Jr., Electromigration study on Cu-Sn interconnections, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, Irvine, CA, 2005, 60-62

  • Tae-Kyu Lee, J.W. Morris, Jr., Seungkyun Lee and John Clarke, Detecting incipient fatigue damage with scanning SQUID microscopy, Review of Quantitative Nondestructive Evaluation, vol.22, 2003, 485-91.

  • Tae-Kyu Lee, D.M. Clatterbuck, J.W. Morris, Jr., T.J. Shaw, Seungkyun Lee and John

  • Clarke, Detecting damage in steel with scanning SQUID microscopy, Review of Quantitative Nondestructive Evaluation, vol.21, 2002, 453-459

  • Meekisho, L.L., Vegetable Oil and Petroleum Oil Cooling Curve characterization using MATLAB, “25th Congress of the International Federation of Heat Treatment and Surface Engineering, 11-14 September, 2018, Xi;an China 

  • Korea Institute of Industrial Technology (KITECH), Invited Talk, October 29, 2014, Incheon, Korea, The impact of microstructure evolution and Sn grain orientation on Lead-free solder interconnect long-term reliability, Tae-Kyu Lee

  • Korea Electronics Technology Institute (KETI), Invited Talk, October 2, 2014, Seoul, Korea, The impact of microstructure evolution and mechanical response on small and large BGA Sn-g-Cu interconnect board level shock performance, Tae-Kyu Lee

  • Hanyang University, MSE, Invited Talk, September 26, 2014, Seoul, Korea, What can a material scientist do in a world of Internet of everything (IoE), Tae-Kyu Lee

  • Washington State University MSE seminar series, Invited Talk, March 28, 2014, Pullman,WA, What can a Material Scientist do in a world of Internet of everything (IoE) : Looking into Sn microstructure to understand the Thermo-mechanical interconnect and joint reliability, Tae-Kyu Lee

  • SEMICON Korea Technology symposium, Invited Talk, February 13-14, 2014, Seoul, Korea, The impact and role of Grain orientation and Anisotropy of Sn in Recrystallization and Damage evolution in Sn-Ag-Cu interconnect reliability, Tae-Kyu Lee

  • SK Hynix R&D center, Invited Talk, February 11, 2014, Icheon, Korea, The impact of Sn anisotropy in solder reliability, recrystalization and damage evolution, Tae-Kyu Lee

  • Electronics and Telecommunications Research Institute (ETRI), Invited Talk, February 7, 2014, Daejeon, Korea, The role of elastic and plastic Anisotropy of Sn in recrystalization and damage evolution, Tae-Kyu Lee

  • Material Science and Engineering Department colloquium, University of California, Berkeley, Invited Talk, September 27, 2012, Berkeley, CA         , The impact of microstructure evolution and Sn grain orientation on Lead-free solder interconnect long-term reliability, Tae-Kyu Lee

  • 141th TMS 2012 annual conference, Invited Talk, March11-15, 2012, Orlando,FL, The Impacts of Palladium Addition on Phase Formation, Microstructure Evolution and Mechanical Reliability in Sn-Ag-Cu/ENEPIG and Sn-Ag-Cu-Pd/ENIG Solder Joint, Chien Fu Tseng, I-Dai Wang, Tae-Kyu Lee, Kuo-Chuan Liu, Chih-Yuan Cheng, Jim Wang, Jeng-Gong Duh

  • 141th TMS 2012 annual conference, invited talk, March11-15, 2012, Orlando,FL, Impact of Pd microalloy added Sn-Ag-Cu solder interconnect board level mechanical shock performance, Tae-Kyu Lee, Bite Zhou and Thomas Bieler

  • International Union of Materials Research Societies (IU-MRS) conference, invited talk, September20, 2011, Taipei, Taiwan, The impact of microstructure evolution and Sn grain orientation on lead-free solder interconnect long-term reliability, Tae-Kyu Lee, KC Liu, and T.R.Bieler

  • 140th TMS 2011 annual conference, Invited Talk, February 27- March 3, 2011, San Diego, CA, Plasticity and Reliability: From Unexpected Plasticity-induced Damages in Advanced Cu Interconnects to Novel Reliability Phenomena in 3-D Interconnect Schemes using Through-Silicon Vias (TSV) Technology, Arief Budiman, Rao Morusupalli, Tae-Kyu Lee, Yu-Lin Shen

  • 140th TMS 2011 annual conference, Invited talk, February 27- March 3, 2011, San Diego, CA, Impact of marine environment on long term reliability of wafer level packages with Sn-Pb and  Sn-Ag-Cu solder interconnects, Tae-Kyu Lee, Bo Liu, Kuo-Chuan Liu, Bite Zhou and Thomas R. Bieler

  • IEEE International Reliability Physics Symposium (IRPS2011), Invited Talk, April10-14, 2011, Monterey, CA, The Role of Elastic and Plastic Anisotropy of Sn on Microstructure and Damage Evolution in Lead-Free Solder joints, Thomas R. Bieler, Bite Zhou, Lauren Blair, Amir Zamiri, Farhang Pourboghrat, Tae-Kyu Lee, and Kuo-Chuan Liu

  • 139th TMS 2010 annual conference, Invited Talk, February 14-18, 2010, Seattle, WA, Impact of isothermal aging on long-term reliability of fine pitch ball grid array package with Sn-Ag-Cu solder interconnects, Tae-Kyu Lee, Weidong Xie, Kuo-Chuan Liu and Thomas R. Bieler

  • 139th TMS 2010 annual conference, Invited Talk, February 14-18, 2010, Seattle, WA, The interaction between imposed current and creep of idealized Sn-Ag-Cu solder interconnects, J.W.Morris, Jr. Christopher  Kinney, Xio Linares, and Tae-Kyu Lee

  • MS&T Conference, Invited Talk, October 25-29, 2009, Pittsburgh, PA, Interactions between Deformation Mechanisms, Microstructure, and Thermal Cycling in Lead-Free Solder Joints, Thomas Bieler; Tae-kyu Lee; Kuo-Chuan Liu

  • 5th TMS 2009 Lead free solder and technology workshop, Invited Talk, February 15, 2009, San Francisco, CA, The influence of imposed current on the creep of Sn rich Pb-free solder, J.W. Morris, Jr., Chris Kinney and Tae-Kyu Lee

  • 5th TMS 2009 Lead free solder and technology workshop, Invited Talk, February 15, 2009, San Francisco, CA, The role of elastic and plastic anisotropy on damage nucleation in lead-free solder joints, Thomas R. Bieler and Tae-Kyu Lee